TechInsights

Home|About Us|Contact|Privacy

User Name

Password

New Full Product Teardown Reports

Cisco DPH151-AT 3G Microcell: The 3G MicroCell™ is designed for AT&T home and small business users in areas experiencing poor cellular wireless coverage. The device, built by Cisco, creates cellular 3G voice and data services locally with a range of up to 5000 square feet. A broadband connection (DSL or cable) is used to create the backhaul connection to the cellular network for wireless calls and WWAN data surfing. The manufacturer claims support for up to ten wireless numbers with up to four voice or data users at once. The Global Positioning System is used to determine the 3G MicroCell™ location and, in combination with connections to the carrier network, allow the device to act as a mini cellular tower. Users in the home or office experience seamless call hand-over to the primary cellular network when leaving the local coverage area.

HTC EVO 4G CDMA/WiMAX Touchscreen Phone: The Sprint branded EVO 4G from HTC is an Android based, dual band CDMA camera phone with 8MP image sensor with flash. This social media geared phone is WiMAX enabled, allowing the user higher data speeds in areas providing 4G coverage. With Sprints’ Hot Spot™, the EVO can act as a WiFi router allowing other WiFi enabled devices to connect to the internet through the EVO. Rounding out the wireless capabilities is Bluetooth, GPS and FM Radio. The user interface for the EVO is a 4.3-inch WVGA display with capacitive touchscreen and an inward facing 1.3MP camera allows for self portraits and video calling.

New Chipography® Reports

Motorola i1 iDen Touchscreen Phone

Samsung Galaxy S GT-i9000 UMTS Touchscreen Phone

Microsoft-Sharp KIN ONE Dual-band CDMA Phone

Microsoft-Sharp KIN Two Dual-band CDMA Phone

Each Product Teardown Report contains:
*	Executive summary
*	Block diagram
*	Detailed, high-resolution, color photos, external & internal hardware
*	Detailed step-by-step disassembly reverse-engineering process
*	Power measurements
*	Circuit board & packaging metrics
*	Complete electrical and mechanical BOM (Bill of Materials)
*	Die photos
*	PCB cross sections
*	System complexity and design benchmarking metrics
*	Manufacturing cost analyses
*	Description of most interesting electronic features and packaging concepts

following are headlines from current notes:

Competitive Alert - August 24, 2010
Nokia Debuts Handset with Touchscreen and Numeric Pad * Does Sony Ericsson Have an Android PlayStation Phone up Its Sleeve? * iPhone 5 May Replace Your Wallet * Oracle Sues Google for Android Patent Infringement * Spansion Sues Samsung Electronics for Violating Patents * PlayStation Engineer Awarded Compensation * Sharp Reduces Output of LCD Panels * AUO to Build LCD Panel Assembly Plant in Guangdong Province, China

Component Technology - September 1, 2010
Canon Develops APS-H Size 120MP CMOS Sensor * Sharp Doubling LCD Module Output in China * Dai Nippon Printing Develops Triple-Axis Accelerometer Only 1mm Thick * Demand for Electronic Components Tapering Off Since July * Intel and Micron Sample-Ship 3-Bit/Cell 64Gbit NAND Flash * Samsung Electronics Increases Dominance in NAND Flash Market * Hynix Kicks Off Volume Production of 20nm 64Gbit NAND Flash * Renesas Electronics and Acacia Research Sign Licensing Deal

Wireless Technologies - August 30, 2010
Sony Develops Technology to Supply Data and Power Using a Single Wire * Japan Communications Introduces microSIM Card for iPhone 4 * Toshiba Rumored to Debut an Android Tablet * Taiwan Media Says 7-in. iPad on the Way * Samsung Electronics Readying Its First LTE Phone * Lack of Applications for Android * Intel and Nokia Team Up in 3D Technology for Handsets * Dell Debuts $100 Smartphone

Know Your Competition ... Know Your Options ... Know Your Opportunities