TechInsights' Chipography® Reports are abbreviated Product Teardown Reports emphasizing the semiconductor content and high-value sub-assemblies (such as camera and display modules) of cellular handsets. Whereas TechInsights' Full Product Teardown Reports provide greater depth of analysis on system design, system complexity metrics, and manufacturing cost estimates, by delivering many more Chipography® Reports per year, TechInsights provides enhanced breadth of coverage of the wireless handset domain through the Chipography® Reports Channel, with analyses of cellular phones from diverse national markets and from all the primary cellular communications protocols. As of July 2009, the Chipography Reports Channel provides product teardown data on over 300 cellular handsets. For coverage of communication cards and dongles used with laptop computers, mobile internet devices, and similar products, consult the TechInsights Mobile Computing & Connectivity Channel. Significant discounts on the license fees for TechInsights Product Teardown Reports in the Chipography Reports Channel are available with the purchase of a Channel License. For more information, contact TechInsights at teardown@ubmtechinsights.com. Chipography® Reports come in three varieties.
TechInsights' Chipography® Reports are abbreviated Product Teardown Reports emphasizing the semiconductor content and high-value sub-assemblies (such as camera and display modules) of cellular handsets. Whereas TechInsights' Full Product Teardown Reports provide greater depth of analysis on system design, system complexity metrics, and manufacturing cost estimates, by delivering many more Chipography® Reports per year, TechInsights provides enhanced breadth of coverage of the wireless handset domain through the Chipography® Reports Channel, with analyses of cellular phones from diverse national markets and from all the primary cellular communications protocols. As of July 2009, the Chipography Reports Channel provides product teardown data on over 300 cellular handsets.
For coverage of communication cards and dongles used with laptop computers, mobile internet devices, and similar products, consult the TechInsights Mobile Computing & Connectivity Channel.
Significant discounts on the license fees for TechInsights Product Teardown Reports in the Chipography Reports Channel are available with the purchase of a Channel License. For more information, contact TechInsights at teardown@ubmtechinsights.com.
Chipography® Reports come in three varieties.
Level 1 Reports identify primary ICs, provide die-size parameters, and include selected die photos and information on major sub-assemblies such as camera and display module.
Level 2 Reports include the Level 1 data elements, but also include price estimates for the ICs and total overall component counts.
Level 3 Reports include the Level 2 data elements, but also include a full bill-of-materials for electronic components.
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