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March 26, 2002
Ise Electronics Uses Nanotubes to Develop 40-inch Color FED Panel
Sanyo Electric Showcases 39.6-inch LCD for LCD TV in EDEX
Sanyo Electric to Ship OEL TVs in Next Fiscal Year
Fujitsu to Make LCD Operation a Separate Entity
Hitachi to Spin Out Display Unit
Hitachi to Commercialize Water-Cooled Notebook PC
Japanese Buildup Board Prices Bottom Out
NEC Develops Repairable Underfill
Sekisui Chemical's Solder-Coated Plastic Particles
March 11, 2002
Nikkei Forecasts Global LCD Industry in 2002
Sharp to Install LCD TV Manufacturing Line in Japan
Recent OEL Developments Around the World
Philips to Produce LCOS in Austria, Toshiba to Ship LCOS-based Projection TVs
Olympus Offers MEMS Foundry Service
Nitto Denko Realizes Complex Circuit with New Assembly Technology
NEC to Reduce Number of Component and Material Suppliers
Aichi Steel Develops Amorphous MI Sensor Module
March 1, 2002
Toshiba Develops Embedded Camera for Cellular Phone
Hitachi Develops Tiny CMOS Camera Module
Hitachi to Release Secure Flash Memory Card
Prices of Memory Cards Fall 60 Percent in One Year
Citizen Subsidiary Posts Sales Increase Despite Sluggish Economy
Fuji Film Adopts Configurable Processor Technology from U.S. Firm
Ricoh Develops Ultra-Miniature Realtime Clock IC
Sekisui Chemical Develops High-Density Multi-Layer Substrate Technology
SPIL Develops Wafer Bumping Technology For 12-inch Wafers
February 22, 2002
Japanese Companies Join to Develop Key Technologies for SIP
Hitachi Cable Ships Packaging Material for LCD Driver ICs
Kodak Licenses PM-OEL Technology to SNMD
Asian PDP Update
Japanese LCD Consortium Targets Commercialization in 2007
Samsung SDI Prototypes AM-OEL Display for 3G Wireless Handset
DoCoMo to Release PHS Handset with Glass-Fine LCD Screen
Taiwan LCD Alliance Wish to Purchase TFT LCD Intellectual Property
February 15, 2002
Can Japan Reclaim Leadership in Packaging Technology?
Shellcase's WLCSP Strategy
Sharp to Market High-Tech Microwave
Alps Electric to Abandon Lead in Electrode Plating
Matsushita Develops New Lead-Free Solder
Component and Product Prices Dropping Quickly for DSCs
Fuji Photo Film Announces New-Generation Super-CCD Honeycomb Technology
Hitachi and Denso Jointly Develop Film for Projecting Large-Size Image
February 8, 2002
Japanese Firm Develops World's Lightest Motor with Smallest Current Draw
Matsushita Subsidiaries Form Alliance in Development of New Buildup Substrates
Nippon Steel Chemical Develops Plastic Cell Substrate with High Heat Resistance
Sharp Develops High-Powered Red Laser Diode for DVD-R/RW Drives
Passive Component Packaging Technology Trends
Fujikura to Begin WLCSP Foundry Operation
LG.Philips LCD Keeps Pushing Large-Format TFT-LCD Panels
HannStar Display to Concentrate on Large-Format TFT-LCD Panels
Digital Still Camera Manufacturers Compete in Lens Performance
Image Sensor Market in 2001
Toshiba to Offer New CMOS Imagers for Higher Quality Images
Toshiba Releases Bluetooth Card for GENIOe PDA
Toshiba to Commercialize 20-GB 1.8-inch HDD
Japanese Firms to Commercialize Micro Fuel Cells in 2003
January 25, 2002
Samsung Electronics Develops CMOS Image Sensor Chips
Rival is Time, says Head of New Color OEL Manufacturing Firm
AU Optronics Plans 5th Gen TFT LCD Manufacturing
Casio to Reduce LCD Panel Costs by Procuring Components from Outside Japan
Sharp to Expand LCD Operation
Nichia and Citizen Electronics Form Alliance in White LEDs
Singaporean Firm Develops Low-Temperature-Compliant Lead-Free Solder
Oki Electric Moves to Volume Production of Boards with Lead-Free Solder
May 20, 2001
Matsushita Electric Works Develops FED Display
Sanyo Electric's FPD Strategy
Daewoo Electronics Attempts to Conquer Chinese PDP TV Market
Manufacturers in Taiwan Push OEL Displays
Philips to Bolster LCD Monitor Production in China
China's Semiconductor Manufacturing Operations on Rise
Casio's WLCSP
Seiko Epson's WLCSP
Sharp's Stacked CSP Technology
Sony Prototypes 8Kbit MRAM Memory Array
Micron Offering Inexpensive Image Sensors
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