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Portelligent TechAlert Service:
Component Technology - Third Quarter 2002

Prior TechAlert Service Articles: 2001 - 2007 Archive
September 26, 2002
Casio Describes High-Performance Copper Inductor Technology
Idemitsu Kosan Develops Improved White OEL Material
Shin-Kobe Electric Machinery Develops Thin Aramid Multilayer Material
Sony to Ship Image Sensors for Cellular Phones
Sanyo Electric to Commercialize OEL TV in FY 2003
Sharp and Hosiden Jointly Prototype Speaker LCD Panel
NEC to Market LCD Monitor with Embedded Speaker
NEC Develops 1.3-Mpixel CMOS Module
Kyocera Develops Tiny Bluetooth Module for Cellular Phones
September 20, 2002
Sony Develops Lead Free Soldering Technologies
Sony Develops World's Tiniest Digital Camera CCD
JVC Adopts Sn-Zn based Lead Free Solder in Industrial Printers
LCD Inventory Rises
Citizen Electronics to Supply White LED Lamp as Flash Unit for Cellular Phone Cameras
Japanese LCD Suppliers Win Huge Orders from European and U.S. Cellular Phone Manufacturers
Matsushita Develops 3D Packaging Technology
Sharp Unveils Details of New CCD for Cellular Phones
Hitachi Gets Serious on FED Development
Kopin Supplies Low Voltage Blue LED
September 11, 2002
Kyocera to Market Bluetooth Module
Sony to Distribute Over 100 Videos for Free
Cyber Graphics Develops Large Non-Organic EL Film
LCD Panel Prices Down Two Months in Row
September 5, 2002
Omron Develops Tiny MEMS Relay
Shinetsu Chemical to Produce Semiconductor Encapsulant in China
Citizen Considers Establishing Backlight Plant in Shanghai
Japanese Materials Suppliers to Set up Semiconductor Material Consortium
Sharp to Establish LCD R&D Base in Mie Plant
Ube to Increase Output of PCB Material
August 19, 2002
Sharp to Introduce PDA Featuring System LCD in November
Sanyo Electric Develops Low-Power LCD for Cellular Phone
KRI Develops Flexible Display Substrate for OEL and LCD
Hitachi to Begin Sampling of Chipset for LTPS LCD
Fujitsu to Boost Production of FRAM
Fuji Xerox Develops Material for Holographic Memory
August 16, 2002
SMK to Commercialize Touch Panel for OEL
Advantest to Set up Consortium to Test Complex Semiconductor Devices
Sharp to Mass Produce 42-inch LCD TV
Fujitsu Moves PCB Manufacturing Operation to Vietnam
NGK Spark Plug to Beef up Production of LTCC Substrates
Hitachi to Release Power-Saving RISC Processor
Mitsubishi Electric Out Sources Advanced ICs
August 8, 2002
Toshiba to Boost Semiconductor Manufacturing Capability in China
Fujitsu Supplies Flash Memory for Bluetooth Chipset to British Firm
Matsushita Develops High-Density Packaging Technology with Conductive Adhesive
Sony Reveals Top Emission Structure Details of 13-Inch OEL
Mitsubishi Materials to Produce Semiconductor Bonding Material in China
July 25, 2002
Pioneer to Construct Third PDP Plant
Kyocera Introduces Compact PLL Module with Embedded TCXO
Fuji Film and Konica to Enter Cellular Phone Camera Component Market
Japanese Companies Tie up in Development of Next-Generation Mobile Electronics Display
Idemitsu Develops Improved White OEL Material
Toshiba Matsushita Display Technology Showcases Low Molecule OEL Display
July 12, 2002
Denso Supplies EL Display for Pachinko Machines
NEC to Boost LCD Driver Manufacturing
JVC Develops Buildup Substrate with Embedded Passives
FHP Develops Enhanced Brightness PDP with Longer Life
Hitachi to Market Bluetooth Chipset for Cell Phones
Canon Providing Equipment for 5th-Generation TFT-LCD Lines
July 11, 2002
Epson to Set up OEL Joint Venture in Japan with CDT
Toshiba Prototypes DRAM on SOI Wafer
Matsushita Prepares New Micro Controller for Video Processing
LG Philips LCD to Invest $1.16 Billion in New LCD Line
Toshiba and Canon to Commercialize New Display Technology in 2003
Seiko Epson Gets the Lead Out
Matsushita Develops Super Slim Speaker for Mobile Electronics
July 2, 2002
Samsung SDI to Launch OEL Production in Second Half 2002
Toshiba Commercializes DSC Resembling Perfume Bottle
Fujitsu Samples Graphic Chip
Toshiba Out Sources Backend Flash Memory Process
Fujitsu Developed Small Area SiP Technology
July 1, 2002
Fujitsu Develops Tiny CMOS Module
NEC Develops MPEG4-Compliant DSP Core
NEC Supplies High Speed CD-R Drive to Dell and Others
DTCT Develops World's Smallest MPEG-4 Module
Matsushita Electric Works Develops Brighter OEL
Fujitsu Develops Low-Temp Lead-Free Solder