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December 19, 2002
Downward Pressure Continues for Cell Phone Color LCD Price
Sony and Sharp Develop Plastic TFT LCD
Hitachi Develops SiP Technology for Microprocessors and Memories
Sony to Boost CCD Output by 60 Percent
Tessera Reveals Plan to Integrate RF Circuit in One Package
Large Format TFT LCDs with LED Backlight to Be Available in 2003
Toshiba to Ship Integrated Bluetooth Chip
NTT Develops Ring Size Speaker
December 10, 2002
Zoran to Ship Fine Pixel Pitch CMOS Sensor For Camera Handsets
FillFactory Develops CMOS Sensor with 13.85M Pixels
Image Sensor Prices for Cellular Phones Remain High
SRAM Prices Continue to Fall
Ultrasonic Semiconductor Bonder
Kyodo Printing Develops Film-based Color Filter for LCDs
Sanyo Electric Develops Smaller Low Power Consumption CCD Module
NEC Develops Small and Thin System in Package
Japanese Corporations Develop 2mm thick Digital Camera Component
November 26, 2002
Downward Price Pressure on SRAM Memory Devices for Cellular Phones
Components for Camera Cellular Phones Thrive in Bleak Economy
Oki Electric Adopts Lead Free Solder in Package Leads
Dai Nippon Printing Develops Tiny Stick Type IC Card Reader/ Writer
Hitachi's Micro Chip to Be Used as Admission Ticket for Japanese Expo
Hitachi Commercializes Half-Size MultiMedia Card
Japanese Firms Expand Production of Power ICs
France Telecom Prototypes Soft Display
November 12, 2002
Fujitsu Develops Hybrid Memory for Portable Electronics
Kaijo Develops World's Fastest Wire Bonder
Samsung Pushes Large-Format Flat-Screen Products
Sharp Embeds CPU in Glass Substrate
Sanyo Electric Develops High-Speed Image-Processing IC for Camera Cellular Phone
Hitachi to Begin LCD Driver IC Production in Singapore
Samsung SDI Begins Mass Production of 256-Color OEL Displays
Sharp Samples 320-Mbit Stacked CSP Memory
October 24, 2002
Demand for Cellular Phone Camera Components Rises
NEC to Debut Micro Controller for Digital Camcorders
OEL Manufacturers Retry for Cellular Phones
TMD Abandons STN, Concentrates on LTPS
Toppoly Pushes LTPS LCD
Elpida Develops 1GB DRAM Module for Notebook PC
Demand for Cellular Phone TFT LCDs Shows Sign of Recovery, But...
October 22, 2002
National Semiconductor Enters Japan's CMOS Sensor Market
Toshiba Matsushita Display to Launch Production of 3.5-inch LTSP TFT LCD
NEC Develops 1.9-inch OEL Display
Sony Develops 3.8-inch SOG Display
Casio Enters Airplane LCD Market
Toshiba Develops VGA CMOS Image Sensor for Cellular Phones
Rohm Enters Cellular Phone Application Processor Market
White LED Lamps for Camera-equipped Handsets
October 14, 2002
Japanese Leading Electronics Manufacturers Boost Output of CCD
Sharp Began Production of System LCDs for Cellular Phones
Sharp to Mass Produce 3D LCD in October 2002
Hitachi to Sample New Processor for Wireless Video Phone
TDK to Commercialize Non Organic EL Display
Japan's Electronic Component Shipment Rose in June
Mitsubishi Electric and Samsung Electronics Tie up in Camera Chipset Development for Cellular Phones
October 3, 2002
FDK Commercializes Tiny DC/DC Converter
Matsushita Develops Signal Processing IC for Digital Still Cameras
Canon Develops 11-Mpixel CMOS Sensor for Digital Still Cameras
Miyota Bolsters Output of Ferroelectric Micro LCDs
Toshiba to Ship Bluetooth Card in SD Card Format
Sanyo Electric Prototypes 15-Inch OEL Display
Seiko Epson's 3D MCM Technology
Infineon Pushing Chip Stacking Technology for Cellular Phones
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