Portelligent TechAlert Service:
Component Technology - First Quarter 2004

Prior TechAlert Service Articles: 2001 - 2007 Archive

March 19, 2004

AIS to Boost LCD Color Filter Output
Toppan Printing to Increase Output of Screens for Rear Projection TVs
NAND vs. NOR
Opto Tech Receives OLED Order from NEC
KDDI Announces Handset Packed with Features
South Korea's One Million-Pixel Cameras for Cellular Phones
Hitachi Ships 400GB HDD
Omron to Set up LCD Back Light R&D Design Center in Hong Kong
Sanyo and Matsushita to Boost Li-ion Battery Output

March 10, 2004

Price Trends for Color LCD Panels for Cellular Phones
Hitachi Displays to Bolster Output of Small-to-Medium Size LCD Panels
Mitsubishi Electric Prototypes Reversible LCD
Samsung Electronics Mass Produces One Chip TFT LCD Module
Fuji Film to Quadruple Image Sensor Output
Sangyo Electric Develops One Million-Pixel CCD Module for Camera Handsets
Optonexus to Mass Produce Glass Lenses for Camera Handsets
Epson Develops LCD Controller IC for Cellular Phones
Toyo Communication Equipment Develops Dual Band SAW Filter

February 25, 2004

Matsushita Develops New Image Sensor for Camera Cellular Phones
Olympus Forays into Cellular Phone Camera Module Business
Sharp Develops 2MPixel CCD Camera Module for Cellular Phones
Price of Cellular Phone Vibration Motors Keeps Falling
LG Developing CDMA Handset using TI's Chipset
ASET Prototypes CCD Fabricating Through-Hole Vias in Silicon
NTT to Commercialize Stamp-Size Optical Memory in 2005
SanDisk Ships 1GB SD Card

January 30, 2004

NAND Flash Memory Activities
Hitachi Maxell to Supply Lens Unit for Mega-Pixel Camera Handset
Samsung Techwin to Supply 1.3M pixel CCD Camera Module
Sony to Supply System on Glass LCD for Cellular Phones
Hitachi Mass Produces Wide Viewing Angle TFT for Cellular Phones
Toshiba Develops Multi-Layering Technology for MCP
Matsushita Kotobuki Develops Low Temperature Melting Lead-Free Solder
Nikon to Produce Digital Still Camera Lens in Thailand

January 12, 2004

Toshiba Develops 0.85-inch HDD
Renesas Develops 3D Image Processing Engine for Cellular Phones
Cellular Phone CMOS Image Sensor Patent Filing Increases in South Korea
0402 Components to Appear in Cellular Phones in 2004
Fujitsu Develops Highly Accurate Bump Forming Technology for Flip Chip Interconnection
3D Cellular Phone Competition to Heat up in South Korea
Rohm to Adopt 3D Audio Technology from Sonaptic
Conductive Polymer for Low-Cost Long-Life Touch Panel