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Portelligent TechAlert Service:
Component Technology - Second Quarter 2004

Prior TechAlert Service Articles: 2001 - 2007 Archive
June 16, 2004
LG Innotek to Ship 1.3M Pixel CCD Camera Module
Simtech Supplies PCB to Samsung Techwin and LG Electronics
Macronix and Saifun to Co-develop Flash Memory
AU Optronics Readying for Mass Production of OEL Panels
Tohoku Pioneer Supplying Phosphorescent OEL Panels
Fujitsu Boosts Camera Sensor Output, Mitsubishi Develops 2M-pixel Camera Module
Oki and Casio Announce Sound Source Chips for Handsets
Sony Commercializes Stamp-size TV Tuner
June 2, 2004
Epson to Ship LCD Controller for 3M Pixel Camera Handset
Hitachi GST to Raise HDD Output in Thailand
Alps Electric to Commercialize 1.3M Pixel Cellular Phone Camera Modules
TMD to Beef up Output of Handset LCD Panels
Canon Develops Color LCD with 30% Less Power Consumption
HI's 3D Polygon Engine used in NEC's N820
Aralion to Foray into Camera Phone ICs
Nokia Seeking South Korean Key Component Suppliers
May 20, 2004
Samsung to Commercialize X3 CMOS Camera Module in 2005
Vodafone to Roll Out Camera Handset with 2x Optical Zoom Feature
Qualcomm’s W-CDMA Chipset Attracts 21 Handset Vendors
Samsung Unveils Development Roadmap for Cellular Phone Fuel Cells
Omron to Debut New PC Card Modem
Sharp to Manufacture Own PCBs
Philips’ Cell Phone Adopts PolyLED
Renesas Develops 1.31M Pixel CMOS Camera Module
May 5, 2004
Hynix Semiconductor Mass Produces 1MPixel CMOS Image Sensors
Sony to Produce Camera Phone CCD Images Sensors in South Korea
Fujitsu Develops Base Station Antenna for Next Generation Cellular Phones
Hitachi Displays to Supply LCDs to Digital Still Cameras
Cellular Phone SiP to Contain 9 Chips
Sharp to Produce LCD Backlights
Thinness of LCD Becomes Priority for Cellular Phone Manufacturers
Alps Electric Developing New Fingerprint Sensors
April 12, 2004
Samsung to Roll Out Liquid Lens-equipped Camera Module in 2004
Philips to Commercialize Liquid Lens in Two Years
Casio and Amkor Tie up in Wafer Level Packaging
Kyocera Develops Bluetooth Module for CDMA Cellular Phones
Sharp to Boost Small to Medium-Size LCD Module Production in China
Microsoft Picks TSMC for Xbox Chip Production
Seagate to Produce Small Size HDD
TMD Prototypes LCD Panel Using 0.2mm Glass Substrate