Samsung to Commercialize X3 CMOS Camera Module in 2005
Vodafone to Roll Out Camera Handset with 2x Optical Zoom Feature
Qualcomm’s W-CDMA Chipset Attracts 21 Handset Vendors
Samsung Unveils Development Roadmap for Cellular Phone Fuel Cells
Omron to Debut New PC Card Modem
Sharp to Manufacture Own PCBs
Philips’ Cell Phone Adopts PolyLED
Renesas Develops 1.31M Pixel CMOS Camera Module

Samsung Electronics of South Korea announced that it will collaborate with the U.S-based image sensor venture Foveon to develop camera sensor modules based on Foveon’s "X3 Direct Image Sensor" in 2004 and to commercialize them in 2005. The announcement was made on May 9, 2004, says the Korean language web site, Digital Times.

The two firms will work together to apply the X3 CMOS sensor technology commercialized for digital still cameras to camera cellular phones. Foveon is going to develop two CMOS sensors based on a 0.18 micron process rule: a ¼-inch 700,000-pixel and a 1/3.5-inch 1.3 million-pixel sensor. Samsung will provide the peripheral circuitry including an image signal processor to supplement the image sensor.

Samsung plans to adopt the 700,000-pixel CMOS sensor and adopt data upscale processing for it to achieve an image capture equivalent to two million pixels. Samsung plans to mass-produce the module in the fourth quarter 2004. The South Korean semiconductor firm also plans to commercialize a camera module achieving 3 million-pixels using the 1.3M-pixel image sensor in the first half 2005.

A Samsung representative commented, "Through mutual collaboration with Foveon, we will be able to import the X3 CIS (CMOS Image Sensor) with clear image quality advantage into cellular phone camera modules and drive the innovation of camera phone image quality." [M. Robertson, Portelligent]

Vodafone of the U.K. is going to debut five new models of second generation (2G) handsets in the Japanese market in upcoming months. Those announced were V602SH, V601T, V401D, V401SA and V402SH. The new models will be introduced one by one starting from late July 2004.

The V602SH supplied by Sharp is claimed as the world’s first handset equipped with 2x optical zoom. Although the camera module supplier for the handset is not revealed, Sharp has been manufacturing its own camera modules for its handsets, so it is natural to assume that the camera module with 2x optical zoom is a product of Sharp. The V602SH features swivel style screen for the main LCD. For image capturing, the LCD can be turned into a view finder.

The other notable features of the V602SH include a 2.4-inch QVGA system LCD supporting 260,000 colors, a 2.02 million-pixel CCD, auto focus, 40x digital zoom and 64 polyphonic ringer tone. It measures 50 mm x 98.5 mm x 24.9 mm and weighs 132g. Pictures are available at: http://www.itmedia.co.jp/mobile/articles/0405/10/news020.html [M. Robertson, Portelligent]

Qualcomm of the U.S. announced on May 13, 2004 that 21 handset manufacturers have selected Qualcomm’s W-CDMA (UMTS) chipset and system software. In addition to previously announced Hisense Group, Huawei Technologies, LG Electronics, Novatel Wireless, Option NV, Samsung, Sanyo Electric, Sierra Wireless, Toshiba, ZTE Corporation, the newly announced include BenQ Corporation, Mitsubishi Electric, Pantech & Curitel, and Vitelcom Mobile Technology. As a W-CDMA (UMTS) chipset supplier, Qualcomm is believed to have the largest client base.

On the same day, Qualcomm also announced base band chips MSM7200, MSM7500 and a convergence platform based on the MSM7600.

The MSM7500 chipset and the MSM7200 chipset will be available on a sample basis in the first quarter 2005 and the fourth quarter 2005 respectively. The MSM7600 chipset is scheduled for sampling in 2006.

On a related note, major South Korean handset vendors are choosing Qualcomm’s MSM6100 chipset, addressing the cdma2000 1x market, in their mega-pixel camera phones, reported Korean language web magazine, Digital Times on May 17, 2004. LG Electronics adopted the MSM6100 in its LG-LP3000 in March 2004 and in the LG-SD330, a 2 million-pixel camera handset, which was introduced recently. http://www.pcbee.co.kr/channel/mobile/news/200405/30330.aspx

LG Electronics plans to adopt the MSM6100 chipset in its high-end models of its new cdma2000 1x lineup. Samsung Electronics adopted the MSM6100 in its SPH-S1000, characterized by MP3 function, 3D engine and a 1 million-pixel camera. http://japanese.chosun.com/site/data/html_dir/2004/05/06/20040506000044.html

Samsung Electronics plans to launch multiple handsets using the MSM6100 in the second half of 2004. Pantech & Curitel also intends to select the MSM6100 for its new handsets targeted to the South Korean market starting from the third quarter 2004. [M. Robertson, Portelligent]

Samsung Advanced Institute of Technology (SAIT) of South Korea showed its development roadmap for fuel cells targeted toward cellular phone application at Small Fuel Cells 2004, which was held in Virginia from May 5, 2004, Nikkei Online reported on May 11, 2004.

SAIT is currently developing 10-50W fuel cells targeted to notebook computers. The Institute plans to begin development of 2-5W small size fuel cells targeted to the fourth generation mobile communication system in around 2006. Energy density is about 200Wh/l currently. The Institute aims to improve the energy density to about 500Wh/l, which is the level of current Li-ion secondary batteries. As low power requirements are more severe for cellular phones, SAIT plans to adopt a passive method which can drive fuel cells more efficiently than an active method which uses a pump and other apparatus to supply methanol to the fuel electrode. Samsung has prototyped fuel cells for cellular phone application. The prototype Samsung developed in 2004 is half the size of the one the company prototyped previously while retaining the same level of output. [M. Robertson, Portelligent]

Omron of Japan is going to roll out PC card style modem which can be used in 28 countries and regions around the world such as the U.S., U.K and Australia. It supports data communication speeds of 56kbps and fax communication speed of 14.4kbps. The VIAGGIO overseas compliant card modem, ME5614CG3, is going to be available on May 22, 2004. The compatible operating systems include Windows Server 2003/XP/2000/Me/98/95/NT4.0, Windows CE 1.0/2.11/3.0, and Mac OS 8.1- 9.2. See a picture at: http://www.itmedia.co.jp/pcupdate/articles/0405/14/news059.html [M. Robertson, Portelligent]

Sharp of Japan is going to install a PCB manufacturing base in its Mihara Plant in Hiroshima prefecture, Nikkei Electronics reported on April 26, 2004. The production facility is going to be completed in December 2004. Sharp has been designing PCBs for its products but has been outsourcing production of PCBs. By installing this manufacturing line, Sharp will be able to handle the design, development and manufacturing of PCBs on its own for its cellular phones. Depending on market demand, Sharp will consider selling its PCBs to other companies. Sharp selected Mihara City as its PCB manufacturing base as Sharp’s cellular phone manufacturing operation is concentrated in Hiroshima prefecture. More concretely, its cellular phone assembly plant is located in Higashi Hiroshima City while CCD and NOR flash EEPROM production facilities reside in Fukuyama City, also in Hiroshima Prefecture. [M. Robertson, Portelligent]

Royal Philips Electronics announced that its new Philips 639 handset will adopt a poly OLED (Organic Light Emitting Diode) display for the outside display. The handset, which will be available in selected countries around the world in the second quarter 2004, features a unique proprietary display technology called “Magic Mirror”. Magic Mirror serves as a mirror during standby mode. When the handset receives a call or mail, the display will switch back to display mode. It is capable of replaying animations. The Philips 639 features an optional add-on camera which supports VGA resolution and 2x digital zoom. [M. Robertson, Portelligent]

Renesas Technology of Japan announced on May 13, 2004 that it has developed a 1.31 million-pixel CMOS image sensor module. The company will begin sample shipment in July 2004 for 10,500 yen (including tax) ($95 @ yen 110/$Us 1) per unit. It will start mass production in August 2004. The module RPS30001H consists of a 1/2.7-inch CMOS sensor supplied by a third party and Renesas’ signal processing LSI. The pixel size is 3.8 x 3.8 micron. The camera module measures 11.04 mm x 12.44 mm x 8.5 mm. Its power consumption is 150mW (at 1.3M pixel, 7.3fps). The camera control method is I2C bus, which is promoted by Philips of the Netherlands. Renesas plans to commercialize modules equipped with auto focus and mechanical shutter in the fourth quarter 2004. Renesas plans to provide signal processing of the auto focus with its LSI. Through development of the new LSI, Renesas successfully achieved a multi-step electronic zoom function by the module itself.

Renesas has been commercially producing 100,000 and 310,000 pixel CMOS camera modules. The company plans to develop 2 million-pixel CMOS camera modules in the future. [M. Robertson, Portelligent]