TechInsights TechAlert Service

Component Technology - Third Quarter 2005

September 27, 2005

Samsung to Launch 16Gbit NAND Flash in 2H 2005
HGST to Produce 8GB 1-inch HDD
Nikon Commercializes DSC with Wireless LAN Feature
Vodafone to Debut Global GPS Handset
Samsung Develops Premium Phone with B&O
Sony to Commercialize Stylish Camcorder/DSC
JVC to Commercialize HDD Audio Player
Citizen Develops 0.6mm Thick Backlight for Cellular Phones

September 19, 2005

Renesas Sample-ships W-CDMA Chip
FDK Working on Super Small DC-DC Converter
Disguising Your Phone for Fun
Sharp Announces 3M pixel CCD Module for Cellular Phones
NOR to NAND, SRAM to DRAM
Supply of NAND Flash Running Short
Casio Ties up with HannStar
LG Electronic Develops W-CDMA DMB Phone
Infineon Supplies Key Components to Xbox 360

September 2, 2005

NEC Challenges RAZR
Sony Commercializes Thin Stylish 5.1MP DSC
Mtekvision Develops Low Power Multimedia Chip for MP3 Phones
KTF Offers Bluetooth Stereo Headset
SK Teletech Adopts iPod-like Navigation Wheel in Cellular Phone
BYD to Supply Batteries to Dell's Notebooks
Huaqi Information Releases Video-capable MP3 Players
Mitac Captures Highest Share in European GPS Market

August 16, 2005

Murata Develops Hybrid Module Supporting FM Radio and Bluetooth
Hitachi Chemical to Boost Output of Die Bonding Film
Tohoku Device to Supply OEL as for LCD Backlight
Optrex Develops New LCD Panel Technology
Fujitsu Device to Market Smallest VGA CMOS Camera Module
LG Innotek Develops World's Smallest 2MP Camera Module
LG Electronics to Commercialize Super Slim 5M Pixel Camera Phone
VK Develops EDGE Chip

July 26, 2005

NTT DoCoMo Prototypes Micro Fuel Cell
NTT DoCoMo Prototypes Non-contact Charger for FOMA Handsets
WILLCOM Markets PHS Communication Module
Solid Alliance to Debut Unique USB Memory
Sharp Develops 0.5mm pitch 3D System in Package
Samsung Electronics Mass Produces 90nm 1Gbit DRAM
Philips to Develop Cell Phone Chip for Low-end Handsets
Headline Item 8 Cypress Unveils Cell Phone CMOS Image Sensor Commercialization Plan

July 11, 2005

Qualcomm to Roll Out DBDM Chip in South Korea
Samsung Electronics Markets Micro Multi Phone
Samsung SDI Develops 3D Display for Gamephone
Samsung Electronics Develops 5 Mega Pixel CIS for Camera Phones
Softbank and Nortel Test Wireless LAN and 3G Handover
ACCESS and Oki Electric Jointly Develop IP Phone Function for Cellular Phones
Toppan Printing Develops Color OEL Panel
Perception Digital to Sell 20GB HDD Audio Player for Less than $200
NJR Develops Motor Driver IC for 10 mm x 10 mm Camera Module