Japan: Recent Developments in Wafer-Level Chip-Scale PackageFirst Coreless Copper Wiring System in Package AnnouncedJapanese Firm Integrates High Frequency Inductor in WLCSPCasio, K&S and Others Collaborate in Next Generation Packaging Technology DevelopmentSharp Develops SOF TechnologyBluetooth ActivitiesNEC Marketing Three-Frequency, Lead-Free Mounting SAW FiltersHitachi Marketing Low-Power CCD Camera ICSeiko-Epson Marketing Small Tuning Fork Type Crystal OscillatorSII Marketing New Two-Layer CapacitorToshiba Marketing LCD with Reduced Terminal Count
Packaging Technology Implementation in Fuji Film's FinePix50iSharp Develops Four-Chip Stacked PackageToshiba Expects To Meet Lead-Free Goal; Seeks Lead-Free SuppliersFujitsu to Introduce Multi-Chip Package with Embedded MPEG-2 Encoder and FCRAMShowa Denko Releases Aluminum Radiator PDP ApplicationsHitachi Releases Diode Products Housed in the World's Smallest CSD PackageYokogawa Marketing 40-Gbps Optoelectronic Communications ModulesMitsubishi Produces Practical APD for 10-Gbps, 50-km TransmissionInphi Develops 50 Gbps IC
Yamato Marketing Lead-Free Solder-Reflow SystemTaiwan Firm ASE Develops MCM BGAIsraeli Firm Develops Flash EEPROM Disk with 9 mm x 11 mm Packaging AreaNOK Commercializes Two-Story Build-up Multi-Layer Flexible PCBFujitsu and Shinko Electric to Discontinue Joint Venture in IrelandMitsubishi Electric Shipping Four-Chip Memory DeviceSamsung Develops 40-Micron-Pitch LDI Package TechnologyPackaging Technology for Compact Olympus Digital CamerasThree-Dimensional Package Trends
Denso Develops Multi-Layer PCB with High Productivity and Recycle CapabilitySanyo Electric to Merge Four Semiconductor Packaging SubsidiariesHitachi Develops Miniature Triaxial Acceleration SensorRohm Develops Super-Small, Super-Thin CSPFlextronics Sets up Japanese SubsidiaryBluetooth IC Prices Forecast To Drop
Toshiba ITC Develops High-Magnification, High-Resolution X-Ray SystemSharp Develops Smart Combo MemoryTDK Volume Producing Laminated Chip InductorsHitachi Develops Single-Chip STN Driver/Control IC
Hitachi Enters EMS MarketHitachi Marketing Reduced-Size Zener DiodeJapan Aviation Electronics Marketing Memory Card Reader/WriterSeiko Epson Claims Crystal Oscillator with World's Smallest PackageRicoh Develops Ultraminiature Power ICToshiba Digital Products to be Lead-Free One Year EarlyToshiba to Ship RISC Microcontrollers with Built-In Peripheral CircuitsCitizen Watch, IBM Japan Prototype Wristwatch-Size Linux ComputerTDK Marketing Plastic Package Cellular Telephone SAW FiltersNEC to Release Mold-Package-Type SAW Filter for Triple-Band CellphonesNEC Infrontia to Market World's Lightest CF Card for PHS Communications
TDK Launches Volume Production of Miniature FilterNEC Develops New Blue-Violet Semiconductor LaserToshiba Producing Si-Ge SemiconductorsSMK Develops Narrow-Pitch Circuit Board ConnectorYokogawa Marketing 40-Gbps Optoelectronic Communications ComponentsRohm Develops Ultraminiature Semiconductor Laser Package
Toshiba Lead-Free Solder ApplicationsToshiba Claims World's First 64-Mbit Pseudo SRAMsFuji Electric Developing Low-Cost PDP DriverMurata Introduces Very Small Surface-Wave Filter for 3G Cellular TelephonesMitsubishi Electric Develops 16-bit Flash-Embedded MCUs in Ultra-Small PackagesCTC Delivers Synchronicity's Web-Based SoC IP Re-Use System to Mitsubishi ElectricSII Releases Voltage-Detector IC with Embedded Delay Circuit
