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Portable consumer electronic products continue to push the state-of-the-art in low-power, high-density IC packaging technologies, with cellular handsets functioning as the primary driver. The Portelligent Tech Perspective "High-Density Packaging Trends in Portable Electronics," reviews current trends in the packaging arena, drawing on recent product teardown analyses. Among the topics addressed in this Tech Perspective are the competition between SiP (System-in-Package) and PoP (Package-on-Package); MCPs (Multi-Chip Packages) versus monolithic IC implementations; applications of MCPs for the packaging of memory devices; and trends in high-density printed circuit boards. Particular attention is paid to the packaging approaches taken in the Apple iPhone 3G.
The Tech Perspective "High-Density Packaging Trends in Portable Electronics" represents the slide set used by David Carey, Portelligent's president and CTO, in a presentation at the 2008 CTEA Electronics Design & Manufacturing Symposium (Austin, Texas, USA -- Oct. 1, 2008). |