TechInsights is making available as a Tech Perspective “Packaging for Portables: Going Vertical and Getting Small,” a presentation made by David Carey, Vice President Technical Intelligence, at the CTEA Electronics Design & Manufacturing Symposium on October 7, 2010 in Austin, Texas. This Tech Perspective examines trends in 3D IC packaging technologies, with emphasis on implementations encountered in cellular handsets and tablet computers, including the Apple iPad 3G tablet, the Motorola Droid X smartphone, and the Apple iPhone 4. Also included is a nostalgic look at earlier 3D electronics packaging technologies used in aeronautics and space exploration, including the Saturn V rocket. |