Teardown.com Login
User Name
Password

Samples
FAQ
What's New
User Resources
All Reports
Tech Perspectives
Data Analysis
Data Tools
Tech Alerts
Newsletter Signup

Apple new iPad (Gen3) A1430 Deep Dive - GSM/W-CDMA/LTE Tablet
Complimentary Teardown Presentation
Follow us on Twitter for instant new report notifications Follow us on Twitter for instant new report notifications

3Com ImpactISDN ModemFull Product Teardown Report
Buy Now

Licensee Download
Available In Channels:
  Digital Home

Date Published:
  March 1999

Licensed User Access Only - Requires Login

Click Here to Download Report .pdf,  File Size: 2.34 MB,  21 Pages

Click Here to Bill of Materials .xls,  File Size: 66.00 KB, 

Contact Us

3Com Impact

ISDN Modem

Full Product Teardown Report

On-line Price (USD): $1,950     - Contact us for Channel License Pricing

Product Description

The 3COM Impact IQ is an ISDN Modem with 128k Dual Channel data sessions, serial port connectivity, and standards-based compression. The ISDN (Integrated Service Digital Networks) signal operates through standard home copper twisted-pair wiring (2Pair), and utilizes the full bandwidth of each channel, since no analog-to-digital conversion is necessary. The unit implementsthe IETF’sstandard CCP (Compression Control Protocol), Hi/fn LZS compression, and uses Multilink PPP to transfer data over two B channels at a data rate of 128Kbps. The modem also features dynamic bandwidth allocation, which automatically reduces the data link to one channel while receiving or making a phone call on a second channel. After the call is over, the modem automatically re-establishes the high-speed, two-channel link.

Product Teardown Report Description

A Product Teardown report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using propietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."

Product Teardown Report Content

Product Teardown / Disassembly Report Contents:

* Detailed external and internal photos
* Detailed step-by-by step teardown photo sequence
* Simplified Block Diagram
* Power measurements
* Circuit board and packaging metrics
* Complete parts lists and component count
* Manufacturing cost analysis
* Description of most interesting features of system architecture and component technologies

Product Teardown Report Value

View us as a wide-angle lens on the personal electronics landscape. We don't replace your expertise and insight, but rather amplify your capabilities and knowledge. Quantitative and qualitative information resources let you answer business-critical questions:

* What enabling electronics technologies are being developed and how will they affect end-products?
* How are my competitors designing with new technologies?
* How does my company compare in competitive benchmarking?
* What technology opportunities are implied from trends in product implementation?
* How will the product features that users want affect our design and technology decisions?



DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.

All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.