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Apple new iPad (Gen3) A1430 Deep Dive - GSM/W-CDMA/LTE Tablet
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Apple MacBook Air A137011.6" NotebookFull Product Teardown Report
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Available In Channels:
  Mobile Computing & Connectivity

Date Published:
  October 2011

Licensed User Access Only - Requires Login

Click Here to Download Report   .pdf,  File Size: 46.05 MB,  172 Pages

Click Here to Bill of Materials   .xls,  File Size: 958.00 KB, 

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Apple MacBook Air A1370

11.6" Notebook

Full Product Teardown Report

On-line Price (USD): $4,950     - Contact us for Channel License Pricing

Product Description

The latest iteration of the Apple MacBook Air, released on July 20, 2011, provides upgrades to both processor performance and connectivity. The base model has an 11.6-in. display in the same form factor as the previous model, but it’s now powered by the new 1.6 GHz dual-core Intel Core i5 processor with 3 MB of shared L3 cache, 2 GB of onboard 1,333 MHz DDR3 memory, and a minimum of 64 GB flash storage. Connectivity includes 802.11a/b/g/n WiFi, Bluetooth 4.0, two USB 2.0 ports, and the new Thunderbolt port, which combines high-speed I/O and a Mini DisplayPort that can simultaneously support peripheral expansion and an external display at WQXGA (2560 x 1600) resolution. The backlit keyboard that was previously removed as a feature has returned in this latest model.

Product Teardown Report Description

A Product Teardown report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using propietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."

Product Teardown Report Content

Product Teardown / Disassembly Report Contents:

* Detailed external and internal photos
* Detailed step-by-by step teardown photo sequence
* Simplified Block Diagram
* Power measurements
* Circuit board and packaging metrics
* Complete parts lists and component count
* Manufacturing cost analysis
* Description of most interesting features of system architecture and component technologies

Product Teardown Report Value

View us as a wide-angle lens on the personal electronics landscape. We don't replace your expertise and insight, but rather amplify your capabilities and knowledge. Quantitative and qualitative information resources let you answer business-critical questions:

* What enabling electronics technologies are being developed and how will they affect end-products?
* How are my competitors designing with new technologies?
* How does my company compare in competitive benchmarking?
* What technology opportunities are implied from trends in product implementation?
* How will the product features that users want affect our design and technology decisions?



DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.

All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.