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HTC x7501 Advantage Windows MobileTri-Band WCDMA, Quad-Band GSM w/ EDGE/HSDPA UMTS Cellular PhoneChipography - Level 2
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Available In Channels:
  Chipography Reports

Date Published:
  November 2007

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Click Here to Download Report   .pdf,  File Size: 10.78 MB,  66 Pages

Click Here to Download Report Board Shots  .pdf,  File Size: 8.86 MB, 

Click Here to Bill of Materials   .xls,  File Size: 165.00 KB, 

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HTC x7501 Advantage Windows Mobile

Tri-Band WCDMA, Quad-Band GSM w/ EDGE/HSDPA UMTS Cellular Phone

Chipography - Level 2

On-line Price (USD): $1,550     - Contact us for Channel License Pricing

Product Description

HTC (High-Tech Computer Corp.) released the Advantage X7501 portable computer/cell phone in August of 2007. Weighing 371 grams and smaller than a paperback book, the X7501 comes equipped with a 5-inch VGA TFT-LCD, touch-screen display, 8GB hard drive, 3MP camera, and miniSD expansion slot. The X7501 also has 3G connectivity (HSDPA/EDGE) along with WiFi, Stereo Bluetooth 2.0, and built-in GPS. The Advantage runs on Microsoft’s Windows Mobile 6 software with Direct Push Technology for e-mail. A 624MHz Marvell (previously Intel) CPU powers the X7501. Other features include HTC VueFLO for navigation through its menus, a TV/VGA port for sending media to an external viewing source, and a miniUSB port. The X7501 can also play music and video. The rechargeable Li-ion battery is rated at 2200mAh, with a standby time of 300 hours for GSM/WCDMA modes. Talk time is reported to be up to 5.5 hours for GSM and 4.5 hours for WCDMA. One of the most interesting features of the X7501 is the industrial design which separates the X7501 into two separate parts, the LCD/Main Body and the QWERTY keyboard base. Strong magnets are used to hold the two parts together during use, forming a micro-notebook like feel.

Product Teardown Report Description

Level 2 Chipography Reports identify primary ICs, provide die-size parameters, and include selected die photos and information on major sub-assemblies such as camera and display module, but also include price estimates for the ICs and total overall component counts.

Product Teardown Report Content

Chipography® Report Contents:

* Product Details
* Major IC Bill of Materials
* Major Components
* Main Board photos
* Main Board IC Identification
* Selected Die Photos
* Selected Display Modules and Board Photos

Product Teardown Report Value

View us as a wide-angle lens on the personal electronics landscape. We don't replace your expertise and insight, but rather amplify your capabilities and knowledge. Quantitative and qualitative information resources let you answer business-critical questions:

* What enabling electronics technologies are being developed and how will they affect end-products?
* How are my competitors designing with new technologies?
* How does my company compare in competitive benchmarking?
* What technology opportunities are implied from trends in product implementation?
* How will the product features that users want affect our design and technology decisions?



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