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Product Description
|  Key Metrics Report - Digital Cameras & Imaging 12/16/2008 - A primary purpose of Portelligent's product teardown analyses is to compile a set of metrics that support product profiling and systematic comparison, as well as identification of trends over time. Whereas Portelligent product teardown reports treat individual products, the Key Metrics Report draws data from our Product Profile Database to facilitate comparisons among products, between handset makers, and at different points in time, as well as to support analysis and comparison of system complexity, semiconductor and component content, and design "fingerprint." This Key Metrics Report covers digital cameras analyzed by Portelligent in its product teardown program since 2002 for product reports published in the Digital Camera's & Imaging Channel.
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Product Teardown Report Description
| The Key Metrics Report provides summary metrics for products analyzed by TechInsights in its product teardown program since 2003. |
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Product Teardown Report Value
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View us as a wide-angle lens on the personal electronics landscape. We don't replace your expertise and insight, but rather amplify your capabilities and knowledge. Quantitative and qualitative information resources let you answer business-critical questions:
* What enabling electronics technologies are being developed and how will they affect end-products?
* How are my competitors designing with new technologies?
* How does my company compare in competitive benchmarking?
* What technology opportunities are implied from trends in product implementation?
* How will the product features that users want affect our design and technology decisions?
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| | | Licensee Download |
Available In Channels:
Digital Imaging
Date Published:
December 2008
Licensed User Access Only -
Requires Login
Click Here to Download Report Estimated Manufacturing Cost
.pdf,
File Size: 2.38 MB,
Click Here to Download Report Camera Weights
.pdf,
File Size: 2.42 MB,
Click Here to Download Report Number of Electronic Assemblies
.pdf,
File Size: 2.81 MB,
Click Here to Download Report Number of Non-Electronic Parts
.pdf,
File Size: 2.42 MB,
Click Here to Download Report Total IC Areas (Die and Packages)
.pdf,
File Size: 3.36 MB,
Click Here to Download Report IC Counts (Die and Packages)
.pdf,
File Size: 3.36 MB,
Click Here to Download Report IC Packaging Efficiencies
.pdf,
File Size: 3.36 MB,
Click Here to Download Report Component Counts for Cameras - Medians
.pdf,
File Size: 70.00 KB,
Click Here to Download Report Total Circuit Areas
.pdf,
File Size: 2.81 MB,
Click Here to Download Report Max Layer Counts
.pdf,
File Size: 2.81 MB,
Click Here to Download Report Electronic Component Counts by Type
.pdf,
File Size: 3.05 MB,
Click Here to Download Report Passive Component Counts by Type
.pdf,
File Size: 2.79 MB,
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DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.
All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.
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