Teardown.com Login
User Name
Password

Samples
FAQ
What's New
User Resources
All Reports
Tech Perspectives
Data Analysis
Data Tools
Tech Alerts
Newsletter Signup

Apple new iPad (Gen3) A1430 Deep Dive - GSM/W-CDMA/LTE Tablet
Complimentary Teardown Presentation
Follow us on Twitter for instant new report notifications Follow us on Twitter for instant new report notifications

Kyocera KX9aCDMA 850/1900 AMPS 850 Cellular PhoneChipography - Level 1
Buy Now

Licensee Download
Available In Channels:
  Chipography Reports

Date Published:
  November 2006

Licensed User Access Only - Requires Login

Click Here to Download Report   .pdf,  File Size: 2.96 MB,  17 Pages

Click Here to Bill of Materials   .xls,  File Size: 117.00 KB, 

Contact Us

Kyocera KX9a

CDMA 850/1900 AMPS 850 Cellular Phone

Chipography - Level 1

On-line Price (USD): $1,250     - Contact us for Channel License Pricing

Product Description

The Kyocera KX9a is a CDMA 850/1900 and AMPS 850 clamshell phone also capable of operating on the CDMA2000 1x network. The display for the KX9a is a 65,536 color, 128 x 128 pixel, STN LCD. It also supports two-way text messaging, eZiText predictive text, EMS, and GPS locator and is wireless web capable. The phone is hearing aid compatible and has voice activated dialing. It also supports downloading and customization of ringtones and graphics, ringer IDs and picture IDs, as well as 32 polyphonic ringtones. It allows for up to 6 entries per its 100 entry phonebook and 30 voice memos up to 2 minutes in length. Other features include: PC Sync, a USB port, multiple language support for English, Spanish, and Portuguese, vibrate alert, alarm, math calculator, tip calculator, games, and a full-duplex speakerphone. The 3.7v, 850mAh, Li-Ion battery reportedly delivers 3.5 hours of talk time and 175 hours of standby time. An extended battery providing 1350mAh is also available at additional cost.

Product Teardown Report Description

Level 1 Chipography Reports identify primary ICs, provide die-size parameters, and include selected die photos and information on major sub-assemblies such as camera and display module.

Product Teardown Report Content

Chipography® Report Contents:

* Product Details
* Major IC Bill of Materials
* Major Components
* Main Board photos
* Main Board IC Identification
* Selected Die Photos
* Selected Display Modules and Board Photos

Product Teardown Report Value

View us as a wide-angle lens on the personal electronics landscape. We don't replace your expertise and insight, but rather amplify your capabilities and knowledge. Quantitative and qualitative information resources let you answer business-critical questions:

* What enabling electronics technologies are being developed and how will they affect end-products?
* How are my competitors designing with new technologies?
* How does my company compare in competitive benchmarking?
* What technology opportunities are implied from trends in product implementation?
* How will the product features that users want affect our design and technology decisions?



DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.

All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.