Teardown.com Login
User Name
Password

Samples
FAQ
What's New
User Resources
All Reports
Tech Perspectives
Data Analysis
Data Tools
Tech Alerts
Newsletter Signup

Apple new iPad (Gen3) A1430 Deep Dive - GSM/W-CDMA/LTE Tablet
Complimentary Teardown Presentation
Follow us on Twitter for instant new report notifications Follow us on Twitter for instant new report notifications

LG LX165 Flare CDMA2000 Cellular PhoneChipography - Level 1
Buy Now

Licensee Download
Available In Channels:
  Chipography Reports

Date Published:
  June 2008

Licensed User Access Only - Requires Login

Click Here to Download Report   .pdf,  File Size: 6.24 MB,  24 Pages

Click Here to Bill of Materials   .xls,  File Size: 119.00 KB, 

Contact Us

LG LX165 Flare

CDMA2000 Cellular Phone

Chipography - Level 1

On-line Price (USD): $1,250     - Contact us for Channel License Pricing

Product Description

Weighing less than 80 grams, the LG Flare LX165 packs many features into a simple clamshell package. The LX165 supports Bluetooth, A-GPS, ringer and picture ID, custom graphics and ringtones, voice dialing, Web browsing, Java, text messaging, flight mode, and downloadable games. The handset integrates two color displays: an external STN-LCD (65,536 colors) and the main TFT-LCD display (262,144 colors). The LX165 supports both English and Spanish and includes a suite of PIM (personal information management) tools, including alarm, to-do list, voice memo recorder, calendar, world clock, and calculator. The LX165 has a reported talk time of 3.5 hours and standby time of 170 hours. Costing only $29.99 with a two-year contract through Sprint or Virgin Mobile, the LX165 uses some time-tested ICs (see pages 17–18) to bring features usually found only in mid-level handsets to a more price-sensitive customer base. *Though LG specifies that the LX165 is PCS (1900MHz) only, the internal chip set (PAs, duplexers, etc.) supports dual-band operation.

Product Teardown Report Description

Level 1 Chipography Reports identify primary ICs, provide die-size parameters, and include selected die photos and information on major sub-assemblies such as camera and display module.

Product Teardown Report Content

Chipography® Report Contents:

* Product Details
* Major IC Bill of Materials
* Major Components
* Main Board photos
* Main Board IC Identification
* Selected Die Photos
* Selected Display Modules and Board Photos

Product Teardown Report Value

View us as a wide-angle lens on the personal electronics landscape. We don't replace your expertise and insight, but rather amplify your capabilities and knowledge. Quantitative and qualitative information resources let you answer business-critical questions:

* What enabling electronics technologies are being developed and how will they affect end-products?
* How are my competitors designing with new technologies?
* How does my company compare in competitive benchmarking?
* What technology opportunities are implied from trends in product implementation?
* How will the product features that users want affect our design and technology decisions?



DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.

All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.