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Nokia N77 GSM 900/1800/1900MHz, WCDMA 2100MHz UMTS Phone with DVB-H Mobile TVChipography - Level 2
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Available In Channels:
  Chipography Reports

Date Published:
  October 2007

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Click Here to Download Report   .pdf,  File Size: 5.79 MB,  40 Pages

Click Here to Bill of Materials   .xls,  File Size: 152.00 KB, 

Board Scan  Board Shots  .pdf,  File Size: 814.00 KB, 

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Nokia N77

GSM 900/1800/1900MHz, WCDMA 2100MHz UMTS Phone with DVB-H Mobile TV

Chipography - Level 2

On-line Price (USD): $1,550     - Contact us for Channel License Pricing

Product Description

The bar-form N77 is Nokia’s second-generation of N-Series smart phone handsets capable of receiving DVB-H TV broadcasts. Through the Program Guide, available in the Mobile TV application, a user can view program info for 7 days, browse TV channels, purchase new channels and select programs of interest. The N77’s display is a 2.4 inch, 16M color, QVGA color LCD that includes an ambient light detector to deliver optimal images in changing light conditions. The N77 has a 2MP camera with a LED flash and 16x digital zoom. Photo gallery software allows direct editing, printing, & sharing of photos. There is also a second CIF camera w/ 2x digital zoom for video conferencing. As a multimedia device, the N77 also has a music player with internal stereo speakers that supports all of the major formats and provides storage for up to 1500 tracks of music. The N77 also includes stereo earphones and supports Nokia Remote Control Audio Adapter. Java applications are available for document viewing among other features, and E-mail, IM, and Push-to Talk join with other connectivity from Bluetooth, IRDA, and USB 2.0 (PC Sync / PC suite). The N77 also supports voice commands and Speaker Independent Name Dialing (SIND). A Talk time of up to 4.5/3.5 hours (GSM/WCDMA) and a Standby time of up to 7.5 days is claimed for the 3.7V-1100mAH Li-Ion Battery.

Product Teardown Report Description

Level 2 Chipography Reports identify primary ICs, provide die-size parameters, and include selected die photos and information on major sub-assemblies such as camera and display module, but also include price estimates for the ICs and total overall component counts.

Product Teardown Report Content

Chipography® Report Contents:

* Product Details
* Major IC Bill of Materials
* Major Components
* Main Board photos
* Main Board IC Identification
* Selected Die Photos
* Selected Display Modules and Board Photos

Product Teardown Report Value

View us as a wide-angle lens on the personal electronics landscape. We don't replace your expertise and insight, but rather amplify your capabilities and knowledge. Quantitative and qualitative information resources let you answer business-critical questions:

* What enabling electronics technologies are being developed and how will they affect end-products?
* How are my competitors designing with new technologies?
* How does my company compare in competitive benchmarking?
* What technology opportunities are implied from trends in product implementation?
* How will the product features that users want affect our design and technology decisions?



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