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RIM Blackberry 8830 CDMA2000/1xEV-DO 800/1900MHz + GSM/GPRS 900/1800MHz Cellular PhoneChipography - Level 2
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Available In Channels:
  Chipography Reports

Date Published:
  August 2007

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Click Here to Download Report   .pdf,  File Size: 6.71 MB,  31 Pages

Click Here to Download Report Board Shots  .pdf,  File Size: 3.08 MB, 

Click Here to Bill of Materials   .xls,  File Size: 120.00 KB, 

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RIM Blackberry 8830

CDMA2000/1xEV-DO 800/1900MHz + GSM/GPRS 900/1800MHz Cellular Phone

Chipography - Level 2

On-line Price (USD): $1,550     - Contact us for Channel License Pricing

Product Description

The BlackBerry 8830 World Edition is the first CDMA/GSM international cell phone from RIM. The 8830 model described here is offered through the wireless carrier, Verizon. In the US, this global broadband Smartphone operates on Verizon’s CDMA2000 voice network and its 1x EV-DO network for data communications. Outside the US, when the 8830 is powered up, the network auto-selection feature attempts to find an available GSM network in the 900 or 1800MHz bands. Other similar international cell phones on the market are the Motorola a840 and Samsung a795. Notable features of the BlackBerry 8830 include the built-in GPS with BlackBerry Maps, a full QWERTY keypad, and several e-mail engines that provides access to as many as 10, “always on, always connected”, e-mail accounts. The 8830 is also equipped with a high-resolution (320 x 240) 2.5- inch, 65,000-color, TFT-LCD display with adjustments to brightness by way of a built-in ambient light sensor. The 8830 is Bluetooth capable, with a multimedia player, headset jack, expandable memory via the microSD slot, 64MB of internal Flash memory, and a USB Port. The BlackBerry 8830 uses a 3.7V, 1400mAh, Li-ion battery to supply power. It is claimed to deliver up to 3.6/5.0 hours (CDMA2000/GSM) of talk time and 216/384 hours (CDMA2000/GSM) of standby time.

Product Teardown Report Description

Level 2 Chipography Reports identify primary ICs, provide die-size parameters, and include selected die photos and information on major sub-assemblies such as camera and display module, but also include price estimates for the ICs and total overall component counts.

Product Teardown Report Content

Chipography® Report Contents:

* Product Details
* Major IC Bill of Materials
* Major Components
* Main Board photos
* Main Board IC Identification
* Selected Die Photos
* Selected Display Modules and Board Photos

Product Teardown Report Value

View us as a wide-angle lens on the personal electronics landscape. We don't replace your expertise and insight, but rather amplify your capabilities and knowledge. Quantitative and qualitative information resources let you answer business-critical questions:

* What enabling electronics technologies are being developed and how will they affect end-products?
* How are my competitors designing with new technologies?
* How does my company compare in competitive benchmarking?
* What technology opportunities are implied from trends in product implementation?
* How will the product features that users want affect our design and technology decisions?



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