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Samsung Ultra Edition II SGH-U700 GSM 900,1800,1900MHz / WCDMA 2100MHz + EDGE / HSDPA UMTS Cellular PhoneChipography - Level 3
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Available In Channels:
  Chipography Reports

Date Published:
  October 2007

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Click Here to Download Report   .pdf,  File Size: 7.19 MB,  78 Pages

Click Here to Bill of Materials   .xls,  File Size: 603.00 KB, 

Board Scan  Board Shots  .pdf,  File Size: 2.23 MB, 

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Samsung Ultra Edition II SGH-U700

GSM 900,1800,1900MHz / WCDMA 2100MHz + EDGE / HSDPA UMTS Cellular Phone

Chipography - Level 3

On-line Price (USD): $2,000     - Contact us for Channel License Pricing

Product Description

Released in August 2007, Samsung’s U700 provides WCDMA/HSDPA, Tri-band GSM/EDGE with download speeds up to 3.6Mbps in the UMTS-I band and also GSM/EDGE capability on 900, 1800, and 1900MHz networks. Along with compatibility with multiple communication networks and fast download speeds, it comes with some impressive features, including a large, crisp 262K-color TFT Smart LCD with four touch-sensitive keys. The U700 also has two cameras, the first a 3.2MP camera using Rapid Focus with a claim of better capture of fast-moving objects, and the second a VGA camera for video telephony. Other notable features include Bluetooth 2.0, a full Internet browser, mobile printing for business and office needs, touch-navigation keypad, and a TV-out feature. Much as with the earlier GSM-only SGH-U600, the U700 packs all functionality into a slender slider-phone format with 12.5mm thickness. The 3.7V, 900mAh*, Li-Ion battery is claimed to deliver up to 5 hours of talk time and 270 hours of standby time but it is unclear whether the times apply to GSM or WCDMA modes.

Product Teardown Report Description

Level 3 Chipography Reports identify primary ICs, provide die-size parameters, and include selected die photos and information on major sub-assemblies such as camera and display module, but also include a full bill-of-materials for electronic components and also include price estimates for the ICs and total overall component counts.

Product Teardown Report Content

Chipography® Report Contents:

* Product Details
* Major IC Bill of Materials
* Major Components
* Main Board photos
* Main Board IC Identification
* Selected Die Photos
* Selected Display Modules and Board Photos

Product Teardown Report Value

View us as a wide-angle lens on the personal electronics landscape. We don't replace your expertise and insight, but rather amplify your capabilities and knowledge. Quantitative and qualitative information resources let you answer business-critical questions:

* What enabling electronics technologies are being developed and how will they affect end-products?
* How are my competitors designing with new technologies?
* How does my company compare in competitive benchmarking?
* What technology opportunities are implied from trends in product implementation?
* How will the product features that users want affect our design and technology decisions?



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