Teardown.com Login
User Name
Password

Samples
FAQ
What's New
User Resources
All Reports
Tech Perspectives
Data Analysis
Data Tools
Tech Alerts
Newsletter Signup

Apple new iPad (Gen3) A1430 Deep Dive - GSM/W-CDMA/LTE Tablet
Complimentary Teardown Presentation
Follow us on Twitter for instant new report notifications Follow us on Twitter for instant new report notifications

Sharp 821SH W-CDMA PhoneChipography - Level 2
Buy Now

Licensee Download
Available In Channels:
  Chipography Reports

Date Published:
  June 2008

Licensed User Access Only - Requires Login

Click Here to Download Report   .pdf,  File Size: 8.45 MB,  49 Pages

Click Here to Bill of Materials   .xls,  File Size: 159.00 KB, 

Contact Us

Sharp 821SH

W-CDMA Phone

Chipography - Level 2

On-line Price (USD): $1,550     - Contact us for Channel License Pricing

Product Description

Offered exclusively from Softbank Japan, the Sharp 821SH is a W-CDMA OneSeg clamshell phone encased in stainless steel. The main 2.6” WQVGA display, like the Sharp AQUOS LCD TV, enables viewing of OneSeg TV broadcasts in landscape mode. The 821SH also has many so-called “S!” applications. For instance, the S! FeliCa security option allows you to pay for items with your phones by just passing the FeliCa symbol over an enabled reader and going. Other S! applications include S! Appli, S! Music Connect, S! Town, S! Information Channel, S! Quick News, S! Friend’s Status/Circle Talk, S! Familiar Usability, and S! Addressbook Back-Up. Other features include Bluetooth, IrDA, simple mode, 2.0-megapixel camera, music player, PC site browser, microSD card, and a monochrome external display located on the back side of the phone. The Sharp 821SH is currently available in seven different colors. When closed, it measures 13.4 mm thick.

Product Teardown Report Description

Level 2 Chipography Reports identify primary ICs, provide die-size parameters, and include selected die photos and information on major sub-assemblies such as camera and display module, but also include price estimates for the ICs and total overall component counts.

Product Teardown Report Content

Chipography® Report Contents:

* Product Details
* Major IC Bill of Materials
* Major Components
* Main Board photos
* Main Board IC Identification
* Selected Die Photos
* Selected Display Modules and Board Photos

Product Teardown Report Value

View us as a wide-angle lens on the personal electronics landscape. We don't replace your expertise and insight, but rather amplify your capabilities and knowledge. Quantitative and qualitative information resources let you answer business-critical questions:

* What enabling electronics technologies are being developed and how will they affect end-products?
* How are my competitors designing with new technologies?
* How does my company compare in competitive benchmarking?
* What technology opportunities are implied from trends in product implementation?
* How will the product features that users want affect our design and technology decisions?



DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.

All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.