Teardown.com Login
User Name
Password

Samples
FAQ
What's New
User Resources
All Reports
Tech Perspectives
Data Analysis
Data Tools
Tech Alerts
Newsletter Signup

Apple new iPad (Gen3) A1430 Deep Dive - GSM/W-CDMA/LTE Tablet
Complimentary Teardown Presentation
Follow us on Twitter for instant new report notifications Follow us on Twitter for instant new report notifications

Sony Ericsson W760 UMTS Phone w/ 3MP CameraChipography - Level 3
Buy Now

Licensee Download
Available In Channels:
  Chipography Reports

Date Published:
  August 2008

Licensed User Access Only - Requires Login

Click Here to Download Report   .pdf,  File Size: 9.65 MB,  99 Pages

Click Here to Bill of Materials   .xls,  File Size: 832.00 KB, 

Contact Us

Sony Ericsson W760

UMTS Phone w/ 3MP Camera

Chipography - Level 3

On-line Price (USD): $2,000     - Contact us for Channel License Pricing

Product Description

Continuing their line of “Walkman”-branded camera phones, Sony Ericsson introduces the W760. In form and function, the phone resembles its candy-bar predecessors such as the W910i (see Portelligent Report #11818-071026-BWd), with A-GPS navigation, mapping, and tracking capabilities added in the W760 features. The traditional focus on integrated entertainment remains, with fast access to music, Web browsing, video, and 3D games. Stereo speakers and optional amplified speaker extension bring emphasis to the musical heritage of the Walkman brand, while a 3.15Mpixel rear-facing camera and 2.2”, 262k-color display define the basic camera phone package. The quad-band GSM, tri-band WCDMA phone features EDGE and HSDPA data transfer, along with USB and Bluetooth. Digital FM radio, text and picture messaging, e-mail and removable M2 memory complete a versatile feature set for a high-end unit. The 3.6V, Li-polymer battery is reported to deliver up 4 hours of talk time and 350 hours standby time in WCDMA mode. GSM node is reported to deliver 9 hours talk time and 400 hours in standby

Product Teardown Report Description

Level 3 Chipography Reports identify primary ICs, provide die-size parameters, and include selected die photos and information on major sub-assemblies such as camera and display module, but also include a full bill-of-materials for electronic components and also include price estimates for the ICs and total overall component counts.

Product Teardown Report Content

Chipography® Report Contents:

* Product Details
* Major IC Bill of Materials
* Major Components
* Main Board photos
* Main Board IC Identification
* Selected Die Photos
* Selected Display Modules and Board Photos

Product Teardown Report Value

View us as a wide-angle lens on the personal electronics landscape. We don't replace your expertise and insight, but rather amplify your capabilities and knowledge. Quantitative and qualitative information resources let you answer business-critical questions:

* What enabling electronics technologies are being developed and how will they affect end-products?
* How are my competitors designing with new technologies?
* How does my company compare in competitive benchmarking?
* What technology opportunities are implied from trends in product implementation?
* How will the product features that users want affect our design and technology decisions?



DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.

All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.